email@example.com | 01484 471180
Farouk received a first class masters degree in electronics engineering from the University of Hull. After which, he was awarded a departmental scholarship to research energy harvesting (EH) conversion mechanisms in the defence of his PhD thesis.
He has worked as a consultant technology analyst and industry analyst for numerous market research firms looking at quantifying the EH and wireless charging industries. Before joining the Institute of Railway Research, he was involved in commercialising several EH devices with US and UK start-up companies and academic institutions.
Currently he is involved with several remote condition monitoring (RCM) and EH projects looking at automating safety critical systems for the railway Intelligent Infrastructure System.
Current areas of research:
Balouchi, F. and Bevan, A. (2016) ‘Detecting Railway Under-Track Voids using Multi-Train In-Service Vehicle Accelerometer’. In: 7th IET Conference on Railway Condition Monitoring, 27-28 September 2016, Birmingham, UK
Gilbert, J. and Balouchi, F. (2014) ‘A vibrating cantilever footfall energy harvesting device’ Journal of Intelligent Material Systems and Structures , 25 (14), pp. 1738-1745. ISSN 1045-389X
Gilbert, J. and Balouchi, F. (2014) ‘Design and optimisation of a footfall energy harvesting system’ Journal of Intelligent Material Systems and Structures , 25 (14), pp. 1746-1756. ISSN 1045-389X
Gilbert, J. and Balouchi, F. (2008) ‘Comparison of Energy Harvesting Systems for Wireless Sensor Networks’ International Journal of Automation and Computing , 5 (4), pp. 334-347. ISSN 1476-8186
Farouk has published several academic papers in the area of energy harvesting for remote condition monitoring and wireless sensor networks. In researching the commercialisation of EH devices he has also authored 2 market research reports on the Energy Harvesting and Wireless Charging industries for Navigant Research.
In his previous role as an engineering lecturer at The University of Hull, Farouk taught embedded systems design, PCB design, and thermal design.