"When Social Science Meets Lean and Digital Technologies" 11th Workshop

11^th International Workshop: When Social Science meets Lean & Digital Technologies, SYMBIOSIS: Humanizing The Digital LEAN

18, 19 June 2024, ÉTS, Montréal, Canada 

The International Workshop When Social Science meets Lean & BIM has been a successful event over the past decade, promoting a forum for discussion on Lean Construction, Building Information Modelling (BIM) and the social sciences. Over the years, the adoption of different technologies and the digitalisation of construction processes have been underpinning topics in the workshop. They also acknowledged the relevance of social aspects as intrinsic and entangled to the interplay between Lean and Digital Technologies, highlighting the need to further investigate the links between digital technologies, Lean Construction, and human behaviour.

Building upon a decade of successful events fostering dialogue between Lean Construction, Building Information Modelling (BIM), and the social sciences, the 11th Workshop ‘Social Science meets Lean and Digital Technologies’ invites researchers and practitioners to contribute short papers exploring this evolving nexus.

This event will be offered as a hybrid event, with the option for virtual attendance and presentation. 

 

IMPORTANT DATES

• 18th January 2024; Call for Short Papers
• 21st March 2024: Short Paper Submission
• 10th April 2024: Short Paper Acceptance Notifications 
• 20th April 2024: In-Person Attendance Confirmation
• 1st May 2024: Workshop Final Program Available
• 18th, 19th June 2024: Workshop Dates
  
  

SHORT PAPER SUBMISSION

Short papers need to be submitted by authors that would like to present their work at the Workshop. Short papers should have a minimum of three pages and a maximum of four pages (plus references).

The short papers should be developed according to the template provided in the link below and submitted via the following link:

Submit your short paper

For further queries or advice, please contact: lean-digitaltechnologies@etsmtl.ca 

including the subject: [SUBMISSION] - Name of First Author